尤特新材料

We specialize in cutting-edge processes such as flip-chip, fan-out, and 3D stacking. By precisely depositing RDL (re-wiring layer) and UBM (under-ball metallization) barrier layers, we significantly enhance packaging density and signal transmission rates while ensuring exceptional adhesion and long-term reliability of the coatings.

Developed specifically for SiC and GaN power devices. We provide electrode and protective film solutions that offer excellent conductivity and structural stability under high-temperature, high-voltage, and high-frequency conditions, meeting the stringent requirements for material durability and stability in power devices.

Empowering micro-electro-mechanical systems (MEMS). Depositing highly uniform sensitive and functional films at the micro-scale ensures that sensors and gyroscopes deliver exceptional sensitivity, reliability, and operational performance.

Supporting the production of capacitors, resistors, and various sensors. By fabricating high-performance conductive and dielectric layers, we effectively enhance the environmental resistance and insulation capabilities of devices, extending product lifespan and maintaining electrical stability.