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Rotatable Si Sputtering Target Chemical Composition: Si Resistivity(20℃):0.01-400Ω. cm Molding process: Spray Density:≥2.26g/cm3(≥96%) Purity:≥99.95% Application: Mainly used for producing SiO2/Si3N4 film, mainly used in Op
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Rotatable Al Sputtering Target Chemical Composition: Al Molding process: Spray Density:≥2.6g/cm3(≥96%) Purity:≥99.9%-99.99% Application: Widely used in decorative & functional coat ing, semiconductor electronics, TFT-LCD
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Rotatable Cu Sputtering Target Chemical Composition: Cu Molding process: Spray Density:≥8.57g/cm3(≥96%) Purity:99.9%-99.99%(according to customer requireme nts) Application:Widely used in decorative & functional coat ing,semiconductor electronics,TFT-LCD
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Rotatable ZnSn Sputtering Target Chemical Composition: ZnSn Molding process: Spray Density:≥6.7 g/cm3 Purity:≥99.9% Application: Widely used in conductive glass, thin filmp hotovoltaic solar energy, Low-E glass film Maximum Mac
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Rotatable ITO Sputtering Target Application: Mainly used for TN,STN type liquid crystal display and t ouch screen,semiconductor electronics,thin film solari ndustry,architectural glass
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Rotatable Ag Sputtering Target Application: Mainly used in Low-E coated glass,thin film solar indust ry,TFT-LCD,semiconductor electronics
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